1. 1。Semiconductor Field2. 半导体领域2。IT Field (Telecommunication System Board)3. IT领域（电信系统委员会）3。Auto Mobile Board Field/High Current Distribution4. 汽车移动板现场/高电流分配4。High Current Power Supply Board5. 大电流电源板5。LED PKG6. LED PKG 6。Medical Equipment BoardOur PCB technology includes1. 医疗设备板我们的PCB技术包括1。HPL technique (Hole Plugging Land): Via on PAD technique, forming via hole under SMD pad2. HPL技术（孔堵塞区域）：Via PAD技术，在SMD pad2下形成通孔。TGFR: Track Gap Filled Resin3. TGFR：填隙树脂3。Multi-copper thickness PCB4. 多铜厚度PCB4。Metal Core PCB Structure5. 金属芯PCB结构5。Special Metal Core PCB: This new technique can radiate heat effectively from product and apply for LED package reflector6. 特殊金属芯PCB：这项新技术可以有效地散发产品的热量，并应用于LED封装反射器6。Special LED PKG PCB: New technique for radiating heat7. 特殊的LED PKG PCB：散热新技术7。Ceramic PCB Metalizing Technique:8. 陶瓷PCB镀金属技术：8。Embedded resistor PCB9. 嵌入式电阻器PCB9。Radiation Solder Mask10. 防辐射面罩10。High Reflection Resin PCB11. 高反射树脂PCB11。High Youngs Modulus Resin: Prevents PCB board crack by its high elasticity at the lead free soldering.12. 高杨氏模量树脂：在无铅焊接时具有高弹性，可防止PCB板破裂。Multi Cavity PCB: Minimizes the PCB thickness &amp chip mounted PCB can be multi stack-up.13. 多腔PCB：最小化PCB厚度芯片安装的PCB可以多层堆叠13。Multi Resin Board PCB多树脂板PCB