深圳卓茂科技有限公司
制造商/工厂
业务性质
Manufacturer
员工人数
51 - 100 People
成立年份
2006
年营业额
US$50 Million - US$100 Million
国家/地区
深圳, 中国
主要产品
BGA rework station, Chipset repair machines, BGA reballing kit, Laptop repair tools, motherboard repair machine, mobile repairing machines, SMD rework station, Reballing station, BGA reballing stencils, hot-air Soldering station, reballing kit for xbox360/PS3/LCD, Laptop motherboard vga chip repair, hot air rework station.
法律地位
Have Own Export License
付款条件
电汇, 信用证, 速汇金, 西联汇款, 现金
关于 深圳卓茂科技有限公司
Shenzhen Zhuomao Technology Co., Ltd是一个以Industrial Plants, Machinery & Equipment产品闻名的大型China BGA rework station, Chipset repair machines, BGA reballing kit, Laptop repair tools, motherboard repair machine, mobile repairing machines, SMD rework station, Reballing station, BGA reballing stencils, hot-air Soldering station, reballing kit for xbox360/PS3/LCD, Laptop motherboard vga chip repair, hot air rework station. Manufacturer。 Shenzhen Zhuomao Technology Co., Ltd的工厂 位于Building A4, Donghua Industrial Park, Bao'an Road, Bao'an, Shenzhen, China Shenzhen Guangdong 518126 China。 Shenzhen Zhuomao Technology Co., Ltd是China中一个知名的组织，正在处理整体市场。 Shenzhen Zhuomao Technology Co., Ltd个人资料 名称：Leron
地址: Building A4, Donghua Industrial Park, Bao'an Road, Bao'an, Shenzhen, China Shenzhen Guangdong 518126
国家: China
主营产品: BGA rework station, Chipset repair machines, BGA reballing kit, Laptop repair tools, motherboard repair machine, mobile repairing machines, SMD rework station, Reballing station, BGA reballing stencils, hot-air Soldering station, reballing kit for xbox360/PS3/LCD, Laptop motherboard vga chip repair, hot air rework station.
成立年份: 2006
出口重点: Canada, India, Saudi Arabia, United Kingdom, United States
估计员工: 51 - 100 People
注册资本: 71% - 80% 百万美元
所有权状态: Private Limited
出口百分比: 71% - 80%
工厂规模: 10, 000-30, 000 square meters
研究团队规模: 11 - 50 People
合同服务: OEM Service Offered
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