yingxinyuan int'l（Group）Ltd

Commitment To Quality

We will go through multiple tests before shipment to ensure 100% qualified delivery to customers. We can provide appearance testing, function testing, reliability testing and other testing services according to customers' specified requirements, and can provide testing reports to customers.

Inspection of appearance

The appearance test refers to the confirmation of the number of chips received, inner packaging, humidity indication, desiccant requirements and appropriate outer packaging. Second, the appearance of a single chip is tested, which mainly includes the typing of the chip, the year, the country of origin, whether the chip is recoated, the status of the pin, whether there are repolishing marks, unknown residue, and the location of the brand logo.

Test of function

Original specification comparison, test function parameter confirmation, discrete component performance test, programmable logic circuit test.

Electrical characteristic test

Check the chip for damage by open circuit and short circuit test using the semiconductor tube characteristic grapher according to the device pin specified by the manufacturer in the datasheet and related instructions.

Failure analysis

Through professional failure analysis equipment and analysis methods to help customers analyze the causes of client product failure and provide failure analysis report and analysis conclusions.

Test of reliability

Test the dynamic function parameters of the product through high and low temperature equipment, in dynamic or static environment. Evaluate whether the product meets the factory requirements according to the test limit parameters.
X-Ray detection

X-ray rays were used to penetrate the chip to detect and analyze its internal structure. X-ray detection can find out whether the internal structure of the tested sample is consistent or there is mixing phenomenon; Mix refers to the same batch of products found in different crystal size, different bases, different wire frame, different wire, etc. In addition, you can intuitively see the chip wire opening, short circuit phenomenon, these will directly lead to product function failure.

Open cover test

Open cover (unseal) mainly uses instruments to corrode the package on the chip surface, check whether there is wafer inside, wafer size, manufacturer's logo, copyright year, wafer code, to determine the authenticity of the chip.